New route to 3D ICs

It has been generally accepted that 3-dimensional ICs are the way forward. However severe challenges have been presented in developing production technologies using either multilayer growth with suitable interconnect techniques or TSVs (through silicon vias). At the recent Semicon West event a third way was proposed by MonolithicIC 3D. They suggest an approach based on the technology Soitec use for making SOI wafers whereby active layers are stacked on top of each other. For full details see the article.