Following my retirement, we have closed our company for new business.

Please do not hesitate to contact me directly, our email portal remeains open and I would be delighted to hear from you and provide ongoing support or advice.

Richard Thomson

support@rta-instruments.com

Companies represented up to the end of December 2023. Please now contact them directly.

k-Space Associates, Inc.
Phone: +1 (734) 426-7977
requestinfo@k-space.com
https://www.k-space.com

STAIB INSTRUMENTS GmbH
Phone: +49 8761 76 24 0
sales@staibinstruments.com
https://www.staibinstruments.com/

Thursday 15 September 2011

New route to 3D ICs

It has been generally accepted that 3-dimensional ICs are the way forward. However severe challenges have been presented in developing production technologies using either multilayer growth with suitable interconnect techniques or TSVs (through silicon vias). At the recent Semicon West event a third way was proposed by MonolithicIC 3D. They suggest an approach based on the technology Soitec use for making SOI wafers whereby active layers are stacked on top of each other. For full details see the article.

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