Following my retirement, we have closed our company for new business.

Please do not hesitate to contact me directly, our email portal remeains open and I would be delighted to hear from you and provide ongoing support or advice.

Richard Thomson

support@rta-instruments.com

Companies represented up to the end of December 2023. Please now contact them directly.

k-Space Associates, Inc.
Phone: +1 (734) 426-7977
requestinfo@k-space.com
https://www.k-space.com

STAIB INSTRUMENTS GmbH
Phone: +49 8761 76 24 0
sales@staibinstruments.com
https://www.staibinstruments.com/

Wednesday 21 March 2012

One tool to write them all?

Extreme ultraviolet lithography (also known as EUV or EUVL) is a next-generation lithography technology using an extreme ultraviolet (EUV) wavelength, currently expected to be 13.5 nm. Anticipated uptake of EUVL may change, according to Burn Lin, Micropatterning Director at Taiwan Semiconductor Manufacturing Company, Ltd. He says that as manufacturers seek to make ever smaller and denser chips, EUV could lose its edge in allowing the industry to follow Moore’s law. The answer may turn out to be switching to electron beam (e-beam) lithography. The move to using 450mm wafers would appear to require the costly development of a variety of patterning tools and resists if a conventional IC fabrication strategy were employed. Since multi-electron beam lithography can be used to write any layer, one 450mm e-beam direct-write tool could pattern them all, and for about 30% lower cost at production volumes. Only one machine would have to be engineered and only a few resists formulated.

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