Thought for the month

“A new idea is delicate. It can be killed by a sneer or a yawn; it can be stabbed to death by a quip and worried to death by a frown on the right man’s brow.” Ovid, Roman Poet (43 BC – 17 AD).

Monday, 18 April 2016

Breaking wafers

In situ high-speed crack propagation within silicon wafers under thermal stress has been imaged simultaneously in direct transmission and diffraction X-ray imaging.

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