Thought for the month
“In the choice between changing one’s mind and proving there is no need to do so, most people get busy on the proof.” John K. Galbraith, Economist (1908 – 2006).
Friday, 16 April 2010
With ever shrinking dimensions within ICs, the role of metrology in maintaining high yield is critical. Researchers are challenged to get accurate measurements of sub-40nm dense trenches and contact holes coming from 193-immersion lithography or e-beam lithography. CEA-Leti's (www.leti.fr) Hybrid Metrology Project has shown noteworthy results in reducing measurement uncertainty at sub-28nm nodes using an alternative 3D-AFM (atomic force microscope) mode for critical measurements (nanotechwire.com/news.asp?nid=9645). The team aims to help equipment makers develop a critical dimension metrology production tool dedicated to hybrid metrology that will reduce R&D cycle time and improve production yield for manufacturers.