Thought for the month
“There is nothing noble in being superior to some other man. The true nobility is in being superior to your previous self.” Probably W.L. Sheldon, US lecturer on ethics (1858 – 1907) rather than Ernest Hemingway.
Friday, 8 April 2011
After several years of discussions it appears that, notwithstanding the above mentioned "power wall" issues, through-silicon-via technology (TSV) is being pushed by several companies to develop 3 dimensional ICs. Reporting on the GSA Memory Conference, Electronic Times notes that a plethora of companies, including IBM, Intel, Samsung, Toshiba, TSMC are exploring the possibility of stacking current devices in a 3-D configuration. Additionally, a 3-D working group within SEMI met for the first time last week to sketch out the initial wafer and tool standards for TSV technology. SEMI has three task groups within its 3-D group. A fourth group is being formed, which may be led by Applied Materials, Inc.