Thought for the month

“You always own the option of having no opinion. There is never any need to get worked up or to trouble your soul about things you can't control. These things are not asking to be judged by you. Leave them alone.”
Marcus Aurelius Antonius, Emperor and Stoic philosopher (121-180).

Friday, 8 April 2011

3D chips

After several years of discussions it appears that, notwithstanding the above mentioned "power wall" issues, through-silicon-via technology (TSV) is being pushed by several companies to develop 3 dimensional ICs. Reporting on the GSA Memory Conference, Electronic Times notes that a plethora of companies, including IBM, Intel, Samsung, Toshiba, TSMC are exploring the possibility of stacking current devices in a 3-D configuration. Additionally, a 3-D working group within SEMI met for the first time last week to sketch out the initial wafer and tool standards for TSV technology. SEMI has three task groups within its 3-D group. A fourth group is being formed, which may be led by Applied Materials, Inc.

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