Following my retirement, we have closed our company for new business.
Please do not hesitate to contact me directly, our email portal remains open and I would be delighted to hear from you and provide ongoing support or advice.
Richard Thomson
support@rta-instruments.com
Companies represented up to the end of December 2023. Please now contact them directly.
k-Space Associates, Inc.
Phone: +1 (734) 426-7977
requestinfo@k-space.com
https://www.k-space.com
STAIB INSTRUMENTS GmbH
Phone: +49 8761 76 24 0
sales@staibinstruments.com
https://www.staibinstruments.com/
Friday, 8 April 2011
3D chips
After several years of discussions it appears that, notwithstanding the above mentioned "power wall" issues, through-silicon-via technology (TSV) is being pushed by several companies to develop 3 dimensional ICs. Reporting on the GSA Memory Conference, Electronic Times notes that a plethora of companies, including IBM, Intel, Samsung, Toshiba, TSMC are exploring the possibility of stacking current devices in a 3-D configuration. Additionally, a 3-D working group within SEMI met for the first time last week to sketch out the initial wafer and tool standards for TSV technology. SEMI has three task groups within its 3-D group. A fourth group is being formed, which may be led by Applied Materials, Inc.
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