Thought for the month
“You cannot have freedom without a rule of law ... and if you don't have it, what you tend to get is corruption and that is death to freedom, it's death to truth, it's death to honour, it's death to democracy.”
Margaret Thatcher, 1 October 1996.
Friday, 8 April 2011
After several years of discussions it appears that, notwithstanding the above mentioned "power wall" issues, through-silicon-via technology (TSV) is being pushed by several companies to develop 3 dimensional ICs. Reporting on the GSA Memory Conference, Electronic Times notes that a plethora of companies, including IBM, Intel, Samsung, Toshiba, TSMC are exploring the possibility of stacking current devices in a 3-D configuration. Additionally, a 3-D working group within SEMI met for the first time last week to sketch out the initial wafer and tool standards for TSV technology. SEMI has three task groups within its 3-D group. A fourth group is being formed, which may be led by Applied Materials, Inc.